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Proceedings of the 2nd International Conference on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics Edited by G. Q.Zhang L. J.Ernst O. de Saint Leger ISBN 0-7803-9806-8, 344 Pages - Prix 100 euros (IEEE conference)

Editorial The organising and technical committees welcome the participants to the 2nd international conference on "Benefiting from Thermal and Mechanical Simulation in (Micro-) Electronics" (EuroSimE 2001) at Maison de la Chimie, Paris, France. The conference is organised by the thematic network COMPETE (www.compete.tm.fr) with major financial sponsoring by the EC, and technical co-sponsoring by IEEE CPMT and IUTAM. As the only international conference specially dedicated to various mechanical and thermal issues in (micro-) electronics, EuroSimE2001 aims to: emphasis the fact that (micro-)electronics is becoming a major driven force and impulse for the further development of mechanics, draw attention from both academic societies and electronic industry for the significant impact of thermal and mechanical related issues on both the electronic industry and modern human life, demonstrate the state-of-the-art competencies and the challenges facing mechanics professionals, promote further research and development for mechanics of (micro-) electronics, promote further development and application of simulation & optimisation methodologies and tools for the electronics industry, improve communication and exchange information between methodology & tool-developers and industry users, strengthen co-operation between industry, universities, and research institutes. This year, more than 50 papers are selected from many countries all over the world. Compared with EuroSimE 2000, EuroSimE 2001 has a clear international character, which will be further strengthened in the subsequent ESIME-conferences. There are totally 8 different sessions entitled Keynote Lectures, Process/Product Design Optimisation, Thermal Mechanical Simulation, Thermal Management, Mechanical Simulation, Verification and Testing, Material Characterisation and Modelling, and Poster. In those sessions, the results of both fundamental research and industrial applications in the fields of thermal and mechanics of (micro)-electronics are presented. This includes the application fields of: Wafer processing and chip design PWB design and application Components and packaging (traditional packages, flip-chip, BGA, CSP, Wafer-Level packages, MCM, Opto-electronic packages, MEMS) Microsystems Interconnections Systems Materials of (micro)-electronics Processes in (micro)-electronics Those 8 sessions cover a broad field of technical subjects including mechanical simulation (both static and dynamic); thermo-mechanical simulation; thermal management; material characterisation and modelling; thin-film mechanics; failure criteria and damage-modelling; continuum and micro-mechanics in (micro)-electronics; interface strengths; experiments for model verification; (micro)-electronic product and/or process optimisation; simulation-based optimisation; virtual thermo-mechanical prototyping in product and/or process design; multi-physics simulation; advanced numerical and analytical simulation methodologies and tools. The organising and technical committees would like to thank all sponsors, speakers, exhibitors, and participants for their valuable support and contribution in making EuroSimE 2001 a success. G.Q. Zhang, L.J. Ernst and O. de Saint Leger

Sommaire / Contents COMPETE, the European Thematic Network on Microelectronics Packaging and Interconnection. O. de Saint Leger, COMPETE co-ordination at MTA, Paris, France Mechanical Simulation in Microelectronics and Photonics Packaging E. Suhir, Bell Laboratories, Lucent Technologies, Inc. USA Electronics Trends in Mobile Communications H. Huomo, Research & Technology Access of Nokia Mobile Phones, Finland Silicon Technology in the 21st Century A.J. van Roosmalen, Philips Semiconductors, The Netherlands Virtual Thermo-Mechanical Prototyping of Microelectronics - The challenges for mechanics professionals G.Q. Zhang, P. Maessen, J. Bisschop, J. Janssen, F. Kuper, Philips, The Netherlands, L.J. Ernst, Delft University of Technology, The Netherlands Trends in the Application of Mechanics to (Micro-) Electronics Dick H. van Campen, Secretary-General of IUTAM, Eindhoven University of Technology, The Netherlands Response Surface Modelling for Non-linear Packaging Stresses W. van Driel, G.Q. Zhang, J.W. Bergsma, G. Steenbergen, Philips, The Netherlands, L. J. Ernst, Delft Univ. of Techn., The Netherlands Robust Multiple Criteria Optimization of Thermally Enhanced PQFP Chia-Lung Chang, Wei-Shin Lin, Nat.Yunlin Univ. of Sc. & Techn. Touliu, Yunlin, Taiwan Simplified Mechanical Model for the Thermomechanical Warpage of Microelectronic Packages Using Response Surface Methodology Eric Egan, National Microelectronics Research Centre (NMRC), Nat. Univ. of Ireland, Gerard Kelly, Cork Institute of Technology, Ireland, Tom O'Donovan, Statistics Department, National University of Ireland, Cork, Ireland Parameterised Modelling of thermo-mechanical reliability for a 5x4 CSP B. Vandevelde, E. Beyne, IMEC, Leuven, Belgium, G.Q. Zhang, J. Caers, Philips CFT, The Netherlands Thermo-mechanical Reliability of Multilayer Ceramic Capacitors: Measurement and Computation J.M.J. den Toonder, C.W. Rademaker, Philips, The Netherlands Probabilistic Approach to Numerical Assessment of Electronic Component Reliability A. Wymyslowski, Wroclaw Univ. of Techn., Inst. of Microsyst. Techn., Wroclaw, Poland Thermally Induced Delamination-Buckling in a Metal-Ceramic Microelectronic Product C.J. Liu, L. J. Ernst, G. Wisse, Delft Univ. of Techn., The Netherlands, G. Q. Zhang, M. Vervoort, Philips CFT, The Netherlands Effect of Chip Anisotropy on Packaging Process Induced Stresses J. Janssen, W. van Driel, J. Bisschop, F. Kuper, R. Schravendeel, Y. Li, G.Q. Zhang, Philips, The Netherlands, D.G. Yang, L.J. Ernst, Delft Univ. of Techn., The Netherlands Modelling of Heat Transfer for System In a Package (SIP) Jiemin Zhou, Central south Univ., Changsha, P.R. China, Xitao Wang, Liu Chen, Johan Liu, Chalmers Univ. of Techn. Gothenburg, Sweden Actuation Unit Analysis of a Thermo-Pneaumatic Actuated Micropump M. Carmona, S. Marco, J. Samitier, Universitat de Barcelona, Spain,.M.C. Acero, J.A. Plaza, J. Esteve, Centro Nacional de Microelectrónica. (IMB-CSIC), Spain A New Thermal Simulation Tool for Optimizing Laser Desoldering of Flip-Chip Components G. Hanreich, J. Nicolics, Vienna Univ. of Technology, Austria Numerical Simulation of Embedded Passive Components in Multi-layer PCBs D. M. Stubbs, S. H. Pulko, A. J. Wilkinson, Univ. of Hull, United Kingdom Thermal Investigation of a Jedec MO-166 Package by Finite Element Simulations Kirsten Weide, Univ. Hannover, Lab. für Inform. Techn Neural Network Methodologies for Modeling, Simulation, and Optimization Q.J. Zhang, Carleton Univ., Ottawa, Ontario, Canada Design for Flip Chip on Flex: A Combined Thermal & Mechanical Modeling & Analysis Xuejun Fan, Philips, USA Lifetime Prediction of Extended Flip-Chip Packages under Thermal and Mechanical Loading B. Wunderle, W. Nüchter, Robert Bosch GmbH, Stuttgart, Germany, A. Schubert, B. Michel, Fraunhofer IZM, Berlin, Germany High Temperature Thermo-Mechanical Analysis of Gas Sensors Substrates J.Puigcorbé, A.Vilà, J.R. Morante, Universitat de Barcelona, Spain An Optimized Shear Test Sample for Assessing Solder Deformation Properties Tommi Reinikainen, Wei Ren, Nokia Mobile Phones, Irving, Texas Structure Investigation of Quad Flat Non-lead Package to Improve Radio-Frequency Application Nansen Chen, Kevin Chiang, Charley Kuo, Kelly Liu, Terry Hsu, T. D. Her, SPIL, Taiwan Experimental Verification of Analytical and FE-models Through Micro-Raman Spectroscopy Ingrid De Wolf, Imec, Leuven, Belgium Characterisation of Lead-Free Solders in Flip Chip Joints S. Wiese, F. Feustel, E. Meusel, Techn. Univ. Dresden, Inst. für Halbleiter- und Mikrosystemtechnik, Germany Time and Temperature Dependent Thermo-Mechanical Characterization and Modeling of a Packaging Molding Compound M. S. Kiasat, L. J. Ernst, Delft Univ. of Techn., The Netherlands, G. Q. Zhang, R. Bressers, Philips, The Netherlands Process Induced Residual Stress Prediction for Microelectronic Packaging Materials During Cure H.A. de Boer, M.H.H. Meuwissen, M.C. van der Wekken, TNO, The Netherlands, P.J.G. Schreurs, M.G.D. Geers, Technical Univ. of Eindhoven, The Netherlands Material Mechanics and Reliability Issues of Lead-Free Solder Interconnects A. Schubert, H. Walter, E. Jung, A. Gollhardt, Fraunhofer-IZM, Berlin, Germany Numerical Optimisation of Gold Creep Model for Thermocompression Bonding J. Puigcorbe, S. Marco, S. Leseduarte, Universitat de Barcelona, Spain, O. Vendier, C. Drevon, Alcatel Space, Toulouse, France, D. Floriot, Thomson-CSF-LCR, Orsay, France, H. Blanck, United Monolithic Semiconductors GmBH, Ulm, Germany, P. Auxemery, United Monolithic Semiconductors SAS, Orsay, France Nano-scratch Behaviour of Diamond-like Carbon Films Li-ye Huang, Ke-wei Xu , Jian Lu, Xian Jiaotong Univ. China, Bruno Guelorget, Univ. de Techn. de Troyes, France Measurement of Thermal Deformation of Interconnection layers Using SIEM Sheng Chang, Fu-Pen Chiang, State Univ. of New York at Stony Brook, USA , Yifan Guo, Motorolla Semiconductor Products Sector, Tempe Arizona, USA Analysis of Damage Mechanisms at Miniaturized Solder Joins, Essentials for Life Time Predictions H.J. Albrecht, B. Schwarz, Siemens AG, Berlin, Germany Three- and Four-Point Bend Testing for Electronic Assemblies Santosh Shetty, Tommi Reinikainen, Nokia Mobile Phones, Irving, Texas Local Stress Analysis on Polymer Stud Grid Array (PSGA) Packages by Raman Spectroscopy and FEM Simula Jian Chen, Bart Vandevelde, Ingrid De Wolf, Imec, Leuven, Belgium, Jef Van Puymbroeck, Marcel Heerman, Siemens, Oostkamp, Belgium Reliability Prediction of Area Array Solder Joints Rainer Dudek, Ralf Döring, Bernd Michel, Fraunhofer IZM, Berlin, Germany An Integrated Modelling Approach to Solder Joint Formation and Fatigue Life Analysis Pan Kai-lin, Zhou De-jian, Chen zi-chen, Huang Chun-yue, Qin Kuang-yu, ZheJiang Univ., HangZhou, PRC Packaging Induced Die Stresses Considering Time-dependence of a Moulding Compound J. Janssen, W. van Driel, J. Bisschop, F. Kuper, R. Schravendeel, Y. LI, R. Bressers, G.Q. Zhang, Philips, The Netherlands, M.S. Kiasat, L.J. Ernst, Delft Univ. of Techn., The Netherlands Coupling of Mechanical and Electrical Behaviours Around a Notch Tip in Piezoelectric Medium Y.L. Li, Y. Sato, K. Watanabe, Univ. of Tokyo, Japan Modelling and Simulation of an Electrostatically Actuated Surface-Micromachined Tunable Fabry-Perot Microinterferometer for the Medium IR Spectral Range C. Calaza, M. Moreno, S. Marco, Universitat de Barcelona, Spain, L. Fonseca, C. Cané, I. Gràcia, Centro Nacional de Microelectrónica (IMB-CSIC), Barcelona, Spain Force Constants for liquid solder bumps with unequal padsizes Co Van Veen, Philips CFT, The Netherlands, Bart Vandevelde, Eric Beyne, Imec, Belgium Numerical Simulation of Delamination in IC Packages Using a New Variable-order Singular Boundary-element A. A. O. Tay, K. H. Lee and K. M. Lim, Centre for IC Failure Analysis and Reliability, Nat. Univ. of Singapore Numerical Method of Reliability Assessment of the Flip-Chip Packaging J. Dziduszko, A. Wymyslowski, K. Friedel, Wroclaw Univ. of Techn. Poland Thermal Management in a New Utra-thin Chip Stack Technology S. Pinel, J. Tasselli, J.P. Bailbe, A. Marty, LAAS-CNRS, Toulouse, France, O. Vendier, M. Huan, ALCATEL SPACE, Toulouse, France, S. Marco, J.R. Morante, Univ. of Barcelona, Spain, E. Beyne, R. Van Hoof, IMEC, Leuven, Belgium State-Of-The-Art of Thermo-Mechanical Modelling of IC Back-End Processes R.B.R. van Silfhout, A. de Boer, H.J.M. Geijselaers, Technical University of Twente, The Netherlands Y. Li , J. Bisschop, F. Kuper, R. Schravendeel, J.H.J. Janssen, W. van Driel, G.Q. Zhang , M. Jansen Philips, The Netherlands Performance of a Thermo-Pneumatic Actuated Micropump: Influence of the Fluidic Components M. Carmona, S. Marco, J. Samitier, Univ. de Barcelona, SIC, Spain SPICE Based Simulations of Electrothermal Processes Piotr Dziurdzia, Univ. of Mining and Metallurgy, Inst. of Electr., Kraków, Poland A Robust Implementation of Stress Governing Equations for Next Generation Process Simulators Slobodan Mijalkovic, Wim Crans, Delft Univ. of Techn. ITS/DIMES Effect of Carrier and Retain Ring Mechanism of Chemical-Mechanical Polishing of the Axial Deformation on Wafer Surface Zone-Ching Lin, Nat. Taiwan Univ. of Sc. & Techn.,Taipei, Taiwan Micro to Macro Thermo-Mechanical Simulation of Wafer-Level Packaging C.A.Yuan, K.N. Chiang, National Tsing Hua University, Taiwan Numerical Simulation of Reactive Interdiffusion in Thin Layers X. Federspiel, M. Ignat, LTPCM/INPG, France Computer Simulation of Grain Growth in a Bidimensional Polycrystalline Films Jianmin Zhang, Kewei Xu, Vincent Ji, Xian Jiaotong Univ. China/ENSAM, Paris, France Finite Element Modelling of Solder Joint Reliability of Plastic Ball Grid Assembly Under Thermal Cyclic Loading X. J. Zhao, Philips CFP, Singapore, G. Q. Zhang, J. Caers, Philips CFP, The Netherlands, L.J. Ernst, Delft Univ.of Techn., The Nethelands A user-friendly thermo-mechanical stress test chip concept; does this exist ? Daniel Vanderstraeten, Gust Schols, Alcatel Microelectronics, Belgium, Oliver Kierse, James Molyneaux, Analog Devices Bv, Ireland, Orla Slattery, Kieran Delaney, National Microelectronics Research Centre, Ireland, Jozef Vanneuville, Klaas Decat, IMEC-KHBO, Belgium, Chan Geok Chai Moses, CS2, Belgium

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